We are seeking an experienced Microelectronics Packaging Materials 
Engineer to 
join the Allegro team. 

In this position you will interface with vendors to evaluate materials and 
processes 
to enhance product and process quality for new package developments and 
continuous improvement of existing packages in production. You will work 
closely 
with the design, quality and reliability, product and marketing engineers 
in a core 
team environment to establish the new automotive device packaging 
requirements 
per automotive industry standards. 

Your responsibilities will include: 

Using appropriate tools, perform complete engineering analysis and 
technology 
assessments to ensure the selected material process and technology will 
result in 
first pass success during qualification and zero defects in mass 
production. 
Evaluating the new packaging materials and process robustness in pre 
qualification 
stage to ensure the first pass success. 
Work on assembly material specifications, process troubleshooting, and 
evaluating 
package qualifications to achieve zero ppm assembly defects in mass 
production 
volume. 
Work with assembly subcontractors in evaluating and qualifying new die 
attach, 
bond wire and plating materials as well as Grade Zero green molding 
compounds in 
high volume production. 
Establishing strong working relationships with internal customers 
marketing, 
design, quality, planning, business units and assembly sub-contractors. 
The successful candidate will possess a minimum of a BS Degree in any of 
the 
following disciplines: Mechanical Engineering, Chemical Engineering, 
Materials 
Science or Theoretical and Applied Mechanics, plus a minimum of 5 years 
related 
experience. Experience in high volume manufacturing of plastic molded 
packages 
with zero defects, and knowledge of advanced electronic packaging plating 
and 
materials to achieve Grade zero automotive IC packaging is required. 

Specific skills needed are:

Familiarity with die attach epoxies, mold compound and wire bond materials 
for 
automotive and commercial semiconductor devices. 
Plating experience with Ag, Ni/Pd/Au and Sn including Sn whisker testing 
and 
control 
Experience with wafer bumping technologies 
A proven track record of using Design Of Experiments to diagnose 
manufacturing 
problems and optimize processes 
SEM, C-SAM, EDX and FTIR experience (operating and understand results) 
Knowledge of CAD is very helpful. 
This position requires a high level of commitment, self-motivation and the 
ability to 
communicate well with multiple departments and levels in the organization 
and 
externally with suppliers. This includes the written and verbal skills 
needed to 
explain complex technical issues